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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Chip-on-board packaging of high-speed optical transceiver applying silicon photonics integrated chips
Kim, Do-Won, Jin, Andy Lim Eu, Yang, Jason Liow Tsung, Kumarasamy, Raja Muthusamy, Qiang, Patrick Lo GuoYear:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412316
File:
PDF, 697 KB
english, 2015