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[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Enabling pre-assembly process of 3D wafers with high topography at the backside
Podpod, A., Demeurisse, C., Inoue, F., Duval, F., Visker, J., De Vos, J., Rebibis, K., Miller, R. A., Beyer, G., Beyne, E.Year:
2015
Language:
english
DOI:
10.1109/eptc.2015.7412326
File:
PDF, 420 KB
english, 2015