SPIE Proceedings [SPIE Photonics West '98 Electronic Imaging - San Jose, CA (Saturday 24 January 1998)] Machine Vision Applications in Industrial Inspection VI - Development of high-speed 3D inspection system for solder bumps
Nishiyama, Youji, Tsukahara, Hiroyuki, Oshima, Yoshitaka, Takahashi, Fumiyuki, Fuse, Takashi, Nishino, Tohru, Rao, A. Ravishankar, Chang, Ning S.Volume:
3306
Year:
1998
Language:
english
DOI:
10.1117/12.301246
File:
PDF, 1.28 MB
english, 1998