SPIE Proceedings [SPIE Microelectronic Manufacturing '99 - Santa Clara, CA (Wednesday 22 September 1999)] Multilevel Interconnect Technology III - Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization
Schmidbauer, Sven, Spinler, Stefan, Lehr, M. U., Klotzsche, J., Hahn, J., Graef, Mart, Patel, Divyesh N.Volume:
3883
Year:
1999
Language:
english
DOI:
10.1117/12.360582
File:
PDF, 1.53 MB
english, 1999