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SPIE Proceedings [SPIE Microelectronics, MEMS, and Nanotechnology - Perth, Australia (Tuesday 9 December 2003)] Microelectronics: Design, Technology, and Packaging - AC-coupled interconnect for high-density high-bandwidth packaging
Franzon, Paul D., Mick, Stephen, Wilson, John M., Luo, Lei, Chandrasakhar, Karthik, Abbott, Derek, Eshraghian, Kamran, Musca, Charles A., Pavlidis, Dimitris, Weste, NeilVolume:
5274
Year:
2004
Language:
english
DOI:
10.1117/12.528076
File:
PDF, 217 KB
english, 2004