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Bending strength of adhesive joints in microelectronic components: Comparison of edge-bonding and underfilling
Akbari, Saeed, Nourani, Amir, Spelt, Jan K.Volume:
88
Language:
english
Journal:
Composites Part A: Applied Science and Manufacturing
DOI:
10.1016/j.compositesa.2016.05.030
Date:
September, 2016
File:
PDF, 3.67 MB
english, 2016