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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 24 January 2004)] Reliability, Testing, and Characterization of MEMS/MOEMS III - The temperature compensation of the silicon piezoresistive pressure sensor using the half-bridge technique
Peng, Kuo Huan, Tanner, Danelle M., Ramesham, Rajeshuni, Uang, C. M., Chang, Yih MinVolume:
5343
Year:
2004
Language:
english
DOI:
10.1117/12.527387
File:
PDF, 171 KB
english, 2004