SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly
Yasuda, Kiyokazu, Kobayashi, Masanao, Fujimoto, Kozo, Miyamoto, Isamu, Helvajian, Henry, Itoh, Kazuyoshi, Kobayashi, Kojiro F., Ostendorf, Andreas, Sugioka, KojiYear:
2012
Language:
english
DOI:
10.1117/12.596735
File:
PDF, 486 KB
english, 2012