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SPIE Proceedings [SPIE Microelectronic Manufacturing 1996 - Austin, TX (Wednesday 16 October 1996)] Microelectronic Device and Multilevel Interconnection Technology II - Process integration of TDEAT-based MOCVD TiN as diffusion barrier for advanced metallization
Gn, Fang H., Li, Qiong, Chan, Lap H., Chooi, Simon Y. M., Chen, Ih-Chin, Sasaki, Nobuo, Patel, Divyesh N., Dixit, Girish A.Volume:
2875
Year:
1996
Language:
english
DOI:
10.1117/12.250878
File:
PDF, 343 KB
english, 1996