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SPIE Proceedings [SPIE SPIE's 27th Annual International Symposium on Microlithography - Santa Clara, CA (Sunday 3 March 2002)] Advances in Resist Technology and Processing XIX - Characterization of a novel photoresist redistribution material for advanced packaging applications
Flack, Warren W., Nguyen, Ha-Ai, Capsuto, Elliott S., Fedynyshyn, Theodore H.Volume:
4690
Year:
2002
Language:
english
DOI:
10.1117/12.474198
File:
PDF, 777 KB
english, 2002