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SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - New route to thermal dry-etching of copper using hydrogen peroside (H2O2) and hexafluoroacetylacetone (HFACH)
Jain, Ajay, Kodas, Toivo T., Hampden-Smith, Mark J., Chen, Fusen E., Murarka, Shyam P.Volume:
2335
Year:
1994
Language:
english
DOI:
10.1117/12.186073
File:
PDF, 409 KB
english, 1994