SPIE Proceedings [SPIE Microelectronic Manufacturing - Austin, TX (Tuesday 18 October 1994)] Microelectronics Technology and Process Integration - Chemical Vapor deposition (CVD) TiN: a barrier metallization for submicron via and contact applications
Littau, Karl A., Mosely, Rod, Eizenberg, M., Tran, Hung V., Sinha, Ashok K., Dixit, Girish A., Jain, Manoj K., Chisholm, Michael F., Havemann, Robert H., Chen, Fusen E., Murarka, Shyam P.Volume:
2335
Year:
1994
Language:
english
DOI:
10.1117/12.186070
File:
PDF, 578 KB
english, 1994