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SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Electrical performance analysis of IC package for the high-end memory device
Lee, Dong H., Han, Chan M., Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.Volume:
3184
Year:
1997
Language:
english
DOI:
10.1117/12.280558
File:
PDF, 918 KB
english, 1997