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SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Hydrogen ion cut technology combined with low-temperature direct bonding
Bower, Robert W., Li, Albert, Chin, Yong-Jian, Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.Volume:
3184
Year:
1997
DOI:
10.1117/12.280579
File:
PDF, 348 KB
1997