![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE International Workshop and Conference on Photonics and Nanotechnology 2007 - Pattaya, Thailand (Sunday 16 December 2007)] ICMIT 2007: Mechatronics, MEMS, and Smart Materials - Effect of the design and the tolerance parameters on the thermosonic transverse bonding flip chip system
Sasaki, Minoru, Jung, Ha Kyu, Kwon, Won Tae, Choi Sang, Gisang, Li, Zushu, Lee, Soo-Il, Ikeura, Ryojun, Kim, Hyungki, Xue, FangzhengVolume:
6794
Year:
2007
Language:
english
DOI:
10.1117/12.783860
File:
PDF, 185 KB
english, 2007