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SPIE Proceedings [SPIE Microelectronic Manufacturing - Santa Clara, CA (Sunday 20 September 1998)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV - Characterization of snap-back breakdown and its temperature dependence up to 300°C including circuit-level model and simulation
Uffmann, Dirk, Prasad, Sharad, Hartmann, Hans-Dieter, Tsujide, TohruVolume:
3510
Year:
1998
Language:
english
DOI:
10.1117/12.324393
File:
PDF, 468 KB
english, 1998