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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 25 January 2003)] MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II - 3-D, Self-aligned, Micro-assembled, Electrical Interconnects for Heterogeneous Integration
Huang, Trent, Nilsen, Erik, Ellis, Matt, Kim, Kabseog, Tsui, Ken, Skidmore, George D., Goldsmith, Chuck, Nallani, Arunkumar, Lee, Jeong-Bong, Janson, Siegfried W.Volume:
4981
Year:
2003
Language:
english
DOI:
10.1117/12.476319
File:
PDF, 403 KB
english, 2003