![](/img/cover-not-exists.png)
SPIE Proceedings [SPIE Asia Communications and Photonics - Shanghai, China (Monday 2 November 2009)] Optoelectronic Materials and Devices IV - Low-temperature Si/Si wafer bonding using boride-treated surface
Song, Hailan, He, Jian-Jun, Huang, Hui, Ren, Xiaomin, Wang, Wenjuan, Huang, YongqingVolume:
7631
Year:
2009
Language:
english
DOI:
10.1117/12.851765
File:
PDF, 4.95 MB
english, 2009