SPIE Proceedings [SPIE ICMIT 2005: Merchatronics, MEMS, and Smart Materials - Chongqing, China (Tuesday 20 September 2005)] ICMIT 2005: Mechatronics, MEMS, and Smart Materials - Study on the packaging integrity testing for polymer micro-device
Wang, Xiao-Peng, Chen, Tian-Ning, Chen, Hua-Ling, Huang, Yong-fu, Wei, Qiang, Wei, Yunlong, Chong, Kil To, Takahashi, Takayuki, Liu, Shengping, Li, Zushu, Jiang, Zhongwei, Choi, Jin YoungVolume:
6040
Year:
2005
Language:
english
DOI:
10.1117/12.664140
File:
PDF, 331 KB
english, 2005