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SPIE Proceedings [SPIE Third International Conference on Smart Materials and Nanotechnology in Engineering - Shenzhen, China (Friday 11 November 2011)] Third International Conference on Smart Materials and Nanotechnology in Engineering - Influence of physical parameters on residual stresses of polymer composites during the cure process
Wang, Hui, Feng, Jiemin, Guo, Zhansheng, Hu, Hongjiu, Zhang, JunqianVolume:
8409
Year:
2012
Language:
english
DOI:
10.1117/12.923775
File:
PDF, 309 KB
english, 2012