SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Optimizing thermal performance-cost trade-off
Dakuginow, Sambu, Apides, Roland, Lacap, Efren, Berg, Mark J., Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.Volume:
3184
Year:
1997
DOI:
10.1117/12.280582
File:
PDF, 844 KB
1997