SPIE Proceedings [SPIE ISMA '97 International Symposium on...

  • Main
  • SPIE Proceedings [SPIE ISMA '97...

SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Optimizing thermal performance-cost trade-off

Dakuginow, Sambu, Apides, Roland, Lacap, Efren, Berg, Mark J., Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
3184
Year:
1997
DOI:
10.1117/12.280582
File:
PDF, 844 KB
1997
Conversion to is in progress
Conversion to is failed