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Curing behavior and thermal and mechanical properties enhancement of tetraglycidyl-4,4′-diaminodiphenylmethane/4,4′-diaminodiphenylsulfone using a liquid crystalline epoxy
Jiang, Hao, Wang, Rumin, Farhan, Shameel, Zhang, Dandan, Zheng, ShuirongVolume:
65
Language:
english
Journal:
Polymer International
DOI:
10.1002/pi.5073
Date:
April, 2016
File:
PDF, 2.09 MB
english, 2016