High aspect ratio “multiple wire” microvias in flexible...

High aspect ratio “multiple wire” microvias in flexible PCBs

Lindeberg, Mikael, Hjort, Klas
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Volume:
35
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120911002370
Date:
November, 2009
File:
PDF, 258 KB
english, 2009
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