![](/img/cover-not-exists.png)
High aspect ratio “multiple wire” microvias in flexible PCBs
Lindeberg, Mikael, Hjort, KlasVolume:
35
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120911002370
Date:
November, 2009
File:
PDF, 258 KB
english, 2009