Interfacial reactions between Sn‐Cu based multicomponent solders and Ni substrates during soldering and aging
Liu, Johan, Zhao, Ning, Ma, Hai‐tao, Wang, LaiVolume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910947435
Date:
April, 2009
File:
PDF, 379 KB
english, 2009