Thermal cycling of flip chips on FR‐4 and PI substrates...

Soldering & Surface Mount Technology 2010 / 06 Vol. 22; Iss. 3

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

Kokko, Kati, Frisk, Laura, Heino, Pekka
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Volume:
22
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540911011054181
Date:
June, 2010
File:
PDF, 296 KB
english, 2010
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