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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates
Kikuchi, Katsuya, Takemura, Koichi, Ueda, Chihiro, Shimada, Osamu, Gomyo, Toshio, Takeuchi, Yukiharu, Okubo, Toshikazu, Baba, Kazuhiro, Aoyagi, Masahiro, Sudo, Toshio, Otsuka, KanjiYear:
2009
Language:
english
DOI:
10.1109/3dic.2009.5306526
File:
PDF, 1.70 MB
english, 2009