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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Investigation on microstructure and resistivity in Cu-TSVs for 3D packaging
Satoh, Akira, Kadota, Hiroyuki, Inami, Takashi, Itou, Masahiko, Onuki, JinYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486826
File:
PDF, 1.10 MB
english, 2016