[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Through Mold Via (TMV) by gas-aided laser
Hsu, Hsiang-Chen, Wu, Shih-Jeh, Lin, Wen-Fei, Hsi, Chi-Shiung, Pao, Hsing-Yi, Wang, Pin-ChiehYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486897
File:
PDF, 1.29 MB
english, 2016