![](/img/cover-not-exists.png)
[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Residual stress measurement of the ground wafer by stepwise corrosion and Raman Spectroscopy
Sun, Jinglong, Qin, Fei, Ren, Chao, Zhongkang, Wang, Liang, TangYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236723
File:
PDF, 970 KB
english, 2015