![](/img/cover-not-exists.png)
[ECS 211th ECS Meeting - Chicago, Illinois (May 6-May 10, 2007)] ECS Transactions - Etching Rate Enhancement of Copper by Adding Sulfur Compounds in Chemical-Mechanical Polishing Slurries
Kanki, Tsuyoshi, Shirasu, Tetsuya, Kimura, Takahiro, Nakamura, Tomoji, Miyajima, MotosyuVolume:
6
Year:
2007
Language:
english
DOI:
10.1149/1.2794455
File:
PDF, 3.42 MB
english, 2007