![](/img/cover-not-exists.png)
Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering
Aziz, M. S. A., Abdullah, M. Z., Khor, C. Y., Fairuz, Z. M., Iqbal, A. M., Mazlan, M., Rasat, M. S. M.Volume:
6
Language:
english
Journal:
Advances in Mechanical Engineering
DOI:
10.1155/2014/275735
Date:
February, 2015
File:
PDF, 20.01 MB
english, 2015