Short-circuit diffusion of ultrasonic bonding interfaces in...

Short-circuit diffusion of ultrasonic bonding interfaces in microelectronic packaging

Junhui Li, Lei Han, Jue Zhong
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Volume:
40
Year:
2008
Language:
english
Pages:
5
DOI:
10.1002/sia.2840
File:
PDF, 510 KB
english, 2008
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