Interface analysis of Ti/Al/Ti/Au ohmic contacts with...

Surface and Interface Analysis 2011 Vol. 43; Iss. 13

Interface analysis of Ti/Al/Ti/Au ohmic contacts with regrown n+-GaN layers using molecular beam epitaxy

Hui-Chan Seo, Shankar Sivaramakrishnan, Jian-Min Zuo, Liang Pang, Philip T. Krein, Kyekyoon (Kevin) Kim
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Volume:
43
Year:
2011
Language:
english
Pages:
5
DOI:
10.1002/sia.3758
File:
PDF, 1.43 MB
english, 2011
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