Fibrous Epoxy Substrate with High Thermal Conductivity and...

Fibrous Epoxy Substrate with High Thermal Conductivity and Low Dielectric Property for Flexible Electronics

Zeng, Xiaoliang, Ye, Lei, Guo, Kun, Sun, Rong, Xu, Jianbin, Wong, Ching-Ping
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Volume:
2
Language:
english
Journal:
Advanced Electronic Materials
DOI:
10.1002/aelm.201500485
Date:
May, 2016
File:
PDF, 5.07 MB
english, 2016
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