Fibrous Epoxy Substrate with High Thermal Conductivity and Low Dielectric Property for Flexible Electronics
Zeng, Xiaoliang, Ye, Lei, Guo, Kun, Sun, Rong, Xu, Jianbin, Wong, Ching-PingVolume:
2
Language:
english
Journal:
Advanced Electronic Materials
DOI:
10.1002/aelm.201500485
Date:
May, 2016
File:
PDF, 5.07 MB
english, 2016