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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - High speed I/O and thermal effect characterization of 3D stacked ICs
Groger, Moishe, Harb, Shadi M., Morris, Devin, Eisenstadt, William R., Puligundla, SudeepYear:
2009
Language:
english
DOI:
10.1109/3dic.2009.5306528
File:
PDF, 624 KB
english, 2009