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[IEEE 1985 EIC 17th Electrical/Electronics Insulation Conference - Boston MA, USA (1985.9.30-1985.10.3)] 1985 EIC 17th Electrical/Electronics Insulation Conference - Compatibility of wire enamel and impregnating agent by means of bond strength evaluation
Steinhaus, RudolfYear:
1985
Language:
english
DOI:
10.1109/eic.1985.7458599
File:
PDF, 2.07 MB
english, 1985