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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Immersion cooling of electronics utilizing lotus-type porous copper
Yuki, Kazuhisa, Hara, Tomohiro, Ikezawa, Soichiro, Anju, Kentaro, Suzuki, Koichi, Ogushi, Tetsuro, Ide, Takuya, Murakami, MasaakiYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486805
File:
PDF, 672 KB
english, 2016