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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Front-side metallization of silane-compoundmodified Si by electroless deposition of Ni(P) and interfacial characterizations
Kuei-Chang Lai,, Pei-Yu Wu,, Tzu-Chien Wei,, Tseng-Chieh Pan,, Chih-Ming Chen,Year:
2016
Language:
english
DOI:
10.1109/icep.2016.7486842
File:
PDF, 924 KB
english, 2016