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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Investigation of connecting techniques for high temperature application on power modules
Kawashiro, Fumiyoshi, Endo, Yoshiki, Tonedachi, Tatsuo, Nishikawa, HiroshiYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486851
File:
PDF, 5.76 MB
english, 2016