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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Warpage characterization analysis for Embedded package technology
Chen, Tang-Yuan, Shih, Meng-Kai, Chen, Ming-Hung, Chen, Wei-Chung, Uegaki, Shoji, Kao, Chin-Li, Yang, Ping-Feng, Hung, Chin-PinYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486881
File:
PDF, 421 KB
english, 2016