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[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements
Bayer, Christoph Friedrich, Waltrich, Uwe, Soueidan, Amal, Baer, Eberhard, Schletz, AndreasYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486884
File:
PDF, 598 KB
english, 2016