Pushing the Limits of Bonded Multi-Wafer Stack Heights...

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Journal of Microelectromechanical Systems 2016

Pushing the Limits of Bonded Multi-Wafer Stack Heights While Maintaining High Precision Alignment

Narimannezhad, Alireza, Jennings, Joshah, Weber, Marc H., Lynn, Kelvin G.
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Year:
2016
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/jmems.2016.2574850
File:
PDF, 6.07 MB
english, 2016
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