SPIE Proceedings [SPIE International Symposium on Polarization Analysis and Applications to Device Technology - Yokohama, Japan (Wednesday 12 June 1996)] International Symposium on Polarization Analysis and Applications to Device Technology - Dynamic variation of internal stress distribution in the curing process of epoxy resin using highly sensitive birefringence measurement system
Yamagishi, Shigekazu, Sekine, Yasuhiro, Zhu, Yongchang, Takada, Tatsuo, Yoshizawa, Toru, Yokota, HideshiVolume:
2873
Year:
1996
Language:
english
DOI:
10.1117/12.246176
File:
PDF, 127 KB
english, 1996