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SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2008)] Advances in Resist Materials and Processing Technology XXV - High-etch-rate low-bias bow outgassing BARC via-filling materials for 193-nm ArF lithographic process
Henderson, Clifford L., Yao, Huirong, Xiang, Zhong, Mullen, Salem, Yin, Jian, Liu, Walter, Shan, Jianhui, Gonzalez, Elleazar, Lin, Guanyang, Neisser, MarkVolume:
6923
Year:
2008
Language:
english
DOI:
10.1117/12.773400
File:
PDF, 536 KB
english, 2008