SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Ultrasonic weak bond evaluation in IC packaging
Jian, Xiaoming, Guo, N., Dixon, Steve, Lopez, Jose F., Quan, Chenggen, Chau, Fook Siong, Fernandez, Francisco V., Lopez-Villegas, Jose Maria, Asundi, Anand, Wong, Brian Stephen, de la Rosa, Jose M., LYear:
2012
Language:
english
DOI:
10.1117/12.621561
File:
PDF, 650 KB
english, 2012