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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Hot embossing characteristics of PEEK compared to PC and PMMA
Murakoshi, Y., Xue Chuan Shan,, Shimizu, T., Maeda, R.Year:
2003
Language:
english
DOI:
10.1109/dtip.2003.1287058
File:
PDF, 671 KB
english, 2003