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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate

Hsu, Hou-Jun, Huang, Jung-Tang, Chao, Pen-Shan, Wu, Chan-Shoue, Shih, Sheng-Hsiung, Yang, Sen-Yeu
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Year:
2006
Language:
english
DOI:
10.1109/emap.2006.4430608
File:
PDF, 2.58 MB
english, 2006
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