[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package
Sakamoto, Norihiko, Takanezawa, Shin, Tsuchikawa, Shinji, Takekoshi, Masaaki, Oohashi, Kenichi, Morita, KojiYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486778
File:
PDF, 1.32 MB
english, 2016