[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Reliability test for integrated Glass interposer
Ching-Kuan Lee,, Jen-Chun Wang,, Yu-Min Lin,, Chau-Jie Zhan,, Wen-Wei Shen,, Huan-Chun Fu,, Yuan-Chang Lee,, Chia-Wen Chiang,, Su-Ching Chung,, Su-Mei Chen,, Chia-Wen Fan,, Hsiang-Hung ChanYear:
2016
Language:
english
DOI:
10.1109/icep.2016.7486780
File:
PDF, 2.20 MB
english, 2016