Using computer models to identify optimal conditions for...

Using computer models to identify optimal conditions for flip‐chip assembly and reliability

Bailey, Christopher, Lu, Hua, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike, Smith, Brian
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Volume:
28
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120210696658
Date:
March, 2002
File:
PDF, 598 KB
english, 2002
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