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Using computer models to identify optimal conditions for flip‐chip assembly and reliability
Bailey, Christopher, Lu, Hua, Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike, Smith, BrianVolume:
28
Language:
english
Journal:
Circuit World
DOI:
10.1108/03056120210696658
Date:
March, 2002
File:
PDF, 598 KB
english, 2002